Patents

1. S.H. Kim, S.E. Lee, Y.K. Ko, Y.S. Moon, J.H. Lee, “Electrochemical Polishing and Plating Method for Manufacturing of Through Via and Bumps in 3D SiP”, Korean Patent 10-1014839 (2011.2.28)

2. S.E. Lee, J.H. Lee, “Determining Method of the End Point of Electropolishing”, Korean Patent 10-1016237(2011.2.14)

3. 임영목, 김두현, 이재호, “니켈도금층이 구비된 탄소폼 및 이의 제조방법”, 대한민국 특허 10-2011-0123460 (2011. 11. 15)