2013

1. Y.S. Song, T.H. Yim, S.K. Park, J.H. Lee, J. Kim, “Metal seed layer sputtering on high aspect ratio through-silicon via for copper filling electroplating”, Electrochimica Acta, Vol. 114, pp. 832-837 (2013)

2. S.Y. Park, M.W. Jung, J.H. Lee, “Nan oxide dispersed nickel composite plating”, Electronic Materials Letter, Vol. 9, pp. 801-804 (2013)

3. J.H. Kim, T.H.Yim, J.H. Lee, “Effects of bath and operating conditions on the composition of Ni-Fe alloy electroplating for solar cell substrate”, Vol. 13, pp. s108-s110 (2013)

4. J.H. Kim, M.W. Jung, T.H. Yim, J.H. Lee, “Effect of Electroplating Parameters on Electrodeposits of Invar Ally”, Journal of the Microelectronics & Packaging Society, Vol. 20, 39-43 (2013)