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2012



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2012

1. H. Lee, H. Yoon, C. Ji, D. Lee, J.H. Lee, J.H. Yun, Y. Kim, “Fabrication of CIGS films by electrodeposition method for photovoltaic cells”, J. of Electronic Materials, Vol. 41, pp. cells”, Vol. 23, pp. 225602-225607 (2012)


2. W. He, J. Qiu, F. Zhuge, X. Li, J.H. Lee, Y.D. Kim, H.K. Kim, Y.H. Hwang, “Advantages of using Ti-mesh type electrodes for flexible dye-sensitized solar (2012)


3. M.W.JungJ.H.KimH.R.LeeT.H.Yim, J.H. Lee, “Fabrication of Nano Silica Dispersed Permalloy Composite Coating”, J. NanosciNanotechnol., Vol. 12, pp. 3402-3407 (2012)


4. T. AtabaevH.Vu, Y.D. Kim, J.H. Lee, H.K. Kim, Y.H. Hwang, “Synthesis and luminescence properties of Ho3+ doped Y2O3 submicron particles”, J. of Physics and Chemistry of Solids, Vol. 73, pp. 176-182 (2012)


5. S.Y. Park, J.H. Lee, “Electrodeposition of NanoTiO2 Powder Dispersed Nickel Composite Coating”, Journal of the Microelectronics & Packaging Society, Vol. 19, 65-69 (2012)


6. H. Lee, C. Ji, S. Woo, M. Choi, Y.H. Hwang, J.H. Lee, Y. Kim, “Formation of Copper Seed Layers and Copper Via Filling with Various Additives”, Kor. J. Mater. Res., Vol. 7, pp. 335-341 (2012)


7. I.S. Kang, Y.S. Koo, J.H. Lee, “The Effects of Levelers on Electroplating of Thin Copper Foil for FCCL”, Journal of the Microelectronics & Packaging Society, Vol. 19, 67-72 (2012)


8. M.W. Jung, K.T. Kim, Y.S. Koo, J.H. Lee, “The Effects of Levelers on Electrodeposition of Copper in TSV Filling”, Journal of the Microelectronics & Packaging Society, Vol. 19, 55-59 (2012)