2008

1. Y. K. Ko, T. H. Yim, J. H. Lee, “The Effects of Electroplating Parameters on the Mechanical Properties of Nickel-Iron Alloy Electrodeposits”, Journal of the Microelectronics & Packaging Society, Vol. 15, No. 4, p. 71-76 (2008)

2. Y. S. Moon, J. H. Lee, “Fabrication of Sn-Cu Bump using Electroless Plating Method”, Journal of the Microelectronics & Packaging Society, Vol. 15, No. 2, p. 17-21. (2008)

3. S. K. Lee, J. H. Lee, “The Effects of Additives on the Electropolishing of Copper Through Via”, Journal of the Microelectronics & Packaging Society, Vol. 15, No. 1, p. 45-50. (2008)

4. D. G. Kim, J. H. Lee, “Fabrication of WC and WC(Co) Codeposited Nickel Composite Coating by Electroplating Method for the Replacement of Chromium Coating, Materials Science Forum Vol. 569 (2008) pp 225-228