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2007



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2007

1. S. K. Lee, Y. H. Kim, J. H. Lee, “Nucleation and Growth of Zinc Particles on an Aluminum Substrate in a Zincate Process”, Journal of Electronic Materials, Vol.36, No. 11,  pp. 1442-1447 (2007)


2. Y. M. Ahn, Y. J. Ko, H. J. Kim, D. H. Lee, S. E. Lee, J. H. Lee, “Effect of Plating Condition on the Mechanical Properties and Residual Stress of Electroplated Copper Film”, Advanced Materials Research, Vol. 26-28, pp. 637-640 (2007)


3. Y. K. KO, T. H. Yim, J. H. Lee, “The effects of Electroplating Parameters on the Morphologies and Composition of Nickel-Iron Alloy Electrodeposits”, J. of the Microelectronics and Packaging Society, Vol. 13, NO. 4, pp. 51-55 (2007)


4. S.E. Lee, J. H. Lee, “Copper Via Filling Using Organic Additives and Wave Current Electroplating”, J. of the Microelectronics and Packaging Society, Vol. 14, No. 3, pp. 37-42 (2007)


5. T. S. Oh, J. H. Lee, J. Y. Byun, T.S. Oh, “Effects of the Additives and Current Density on the Electrodeposition Behavior and Mechanical Properties of the Ni-SiC Composite Coatings”, Key Engineering Materials, Vol. 345-346, pp. 1533-1536 (2007)


6. Y. S. Moon, J. Y. Byun, T. S. Oh, J. H. Lee, “The Fabrication of Nickel-Diamond Composite Coating by Electroplating Method”, J. of the Microelectronics and Packaging Society, Vol. 14, No. 1, pp. 55-60 (2007)