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2006



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2006

1. K. Y. Lee, T. S. Oh, T. S. Oh, J. H. Lee, “Electrical characteristics of the three dimensional interconnection structure for the chip scale package with Cu through vias”, J. of Electronic Materials, Vol.36, No.2, pp. 123-128 (2006)


2. J. H. Lee, “Direct Electroless Copper Plating on Polyimide fro FPCB Applications”, Materials Science Forum, Vol.544-545, pp. 709-712 (2006)


3. B. H. Cho, W. J. Lee J. H. Lee, “Effects of Electroplating Parameters on the Defects of Copper Via for 3D SiP”, Solid State Phenomena, Vol.124-126, pp.49-52 (2006)


4. W. Cho, Y. J. Ko, Y. M. Ahn, G. H. Chang J. H. LEE, “The Effects of Current Type and Density on Dishing Phenomena in CMP Process“, Solid State Phenomena, Vol. 124-126,  pp. 307-310 (2006)


5. Y. K. Ko, G. H. Chang J. H. LEE, “Nickel Tungsten Alloy Electroplating for the High Wear Resistant Materials Applications“, Solid State Phenomena, Vol. 124-126, pp. 1589-1592 (2006)


6. S. Y. Chang, Y. L. Kim, B. H. Song, J. H. LEE, “Effects of Current Ratio on Plasma Electrolytic Oxide Coatings on Mg-Al Alloy”, Solid State Phenomena, Vol. 124-126, pp. 767-770 (2006)


7. S. Y. Chang, Y. L. Kim, B. H. Song J. H. LEE, “Mechanical and Electrochemical Properties of Plasma Electrolytic Oxide Coatings on Magnesium Alloys”, Materials Science Forum, Vol. 539-543, pp. 1224-1229 (2006)


8. G. H. Chang, J. H. LEE, “Non-Electrolytic Deposition of Silver on Tungsten Powders for Functionally Gradient Composite Powder“, Materials Science Forum, Vol. 534-536, pp.1469-1472 (2006)


9. G. H. Chang J. H. LEE, “The Effects of Current Types on Through Via Hole Filling for 3D-SiP Application “, J. of the Microelectronics and Packaging Society, Vol.13, No.4, pp.45-50 (2006)


10. D. G. Kim J. H. LEE, ” Electrodeposition Behavior of Ni-WC Composite Coatings with Variation of WC Particle Size”, J. of the Korean Institute of Surface Engineering, Vol.39, No.3, pp. 115-120 (2006)


11. S. S. Byun, J. H. LEE, “The Effects of Copper Electroplating Bath on Fabrication of Fine Copper Lines on Polyimide Film Using Semi-additive Method “, J. of the Microelectronics and Packaging Society, Vol.13, No.2 (2006)


12. J. H. Min, J. H. Wu, J. U. Cho, Q. X. Liu, J. H. Lee, Y. D. Ko, J. S. Chung, Y. K. Kim, J. H. Lee, “The pH and current density dependence of DC electroplated CoCu thin films “, J. of Magnetism and Magnetic Materials, Vol.304, pp.100-102 (2006)


13. G. H. Chang, S. Y. Chang J. H. Lee, “Via/Hole Filling by Pulse-Reverse Copper Electroplating for 3D SiP”, Materials Science Forum, Vol. 510-511, pp. 942-945 (2006)