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2005



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2005

1. S. W. Jun, K. Y. Lee, H. J. Won, J. Y. Byun, T. S. Oh, J. H. Lee, “Mechanical Properties of Ni Films and Ni-Al2O3 Composite Films Fabricated by Electroplating”, J. of the Microelectronics and Packaging Society, Vol.12, No. 3, pp. 256-265 (2005)


2. J. S. Bae, G. H. Chang, J. H. Lee, “Electroplating of Copper Using Pulse-Reverse Electroplating Method for SiP Via Filling”, J. of the Microelectronics and Packaging Society, Vol.12, No. 2, pp. 129-134 (2005)


3. K.Y. Lee, T.S. Oh, H.J. Won, T.S. Oh, J. H. Lee, “Interconnection Process and Electrical Properties of the Interconnection Joints for 3D Stack Package with 75 Cu Via”, J. of the Microelectronics and Packaging Society, Vol. 12, No. 2, pp. 111-119 (2005)