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1. I. G. Lee, T. Kang, N. S. Kim, S. Y. Oh, J. H. Lee, “The effects of bath composition on the morphologies of electroless nickel under-bump metallurgy on Al input/output pad”,  J. of  Electronic Materials, Vol.34, No.1 (2004)

2. J. H. Lee, “Electroless copper plating for metallization or electronic devices”, J. of the Microelectronics and Packaging Society, Vol.11, No.4, pp.75-80 (2004)

3. J. Y. Kim, J. Yu, T. Y. Lee, J. H. Lee, “The effects of electroplating parameters on the7composition and morphology of Sn-Ag solder”, J. of Electronic Materials, Vol.33, No.12, pp. 1459-1464 (2004)

4. J. S. Bae, J. H. Lee, “Copper via filling for SiP by pulse reverse electroplating”, MAP2004, pp.43 (2004)

5. W. Cho, Y. J. Ko, Y. M. Ahn, G. H. Chang., J. H. Lee, “Electrochemical kinetics study of electroless copper plating for electronics application”, Materials Science Forum, Vol.449,  pp.393-396 (2004)

6. H. Lee, K. Y Lee, J. S Bae, J. H Lee, J. Y Byun, D. B. Hyun, T. S. Oh,  Electrodeposition of Bi2Te3 for nanowire application”, Materials Science Forum, Vol.449,  pp.377-380 (2004)