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2011



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2011

1. J.Y. Lee, J.H. Lee, “Effects of Electrochemical Parameters on Electrochemical Silicon Etching in Porous Silicon Layer Transfer Process”, J. Ceramic Proc. Res., Vol. 12, pp. 89-92 (2011)


2. S.Y.Cheon, S.Y. Park, Y.M. Ryim, D.H. Kim, J.H. Lee, “The Effects of Bath Conditions on the Electroless Nickle Plating on the Porous Carbon Substrate”, Curr. Appl. Phys., Vol. 11, pp.790-793 (2011)


3. S.Y. Park, M.W. Jung, J.H. Lee, “Dispersion Method of Silica Nanopowders for Permalloy Composite Coating”, Journal of the Microelectronics & Packaging Society, Vol. 18, 39-42 (2011)


4. S.Y. Cheon, Y.M. Rhym, J.H. Lee, “The Effects of Additives and Residual Stresses on the Electroless Nickel Plating on Carbon Substrate”, Journal of the Microelectronics & Packaging Society, Vol. 18, 43-48 (2011)


5. J.Y. Shim, Y.S. Moon, J.H. Lee, “Electrochemical Study of the Effect of Additives on High Current Density Copper Electroplating”, Journal of the Microelectronics & Packaging Society, Vol. 18, 49-54 (2011)


6. J.Y. Lee, Y.S. Koo, J.H. Lee, “Optimization of Electrochemical Etching Parameters in Porous Silicon Layer Transfer Process for Thin Film Solar Cell”, Journal of the Microelectronics & Packaging Society, Vol. 18, 23-27 (2011)


7. J.Y. Shim, Y.S. Moon, K.S. Hur, Y.S. Koo, J.H. Lee, “The Effect of Additives on the High Current Density Copper Electroplating”, Journal of the Microelectronics & Packaging Society, Vol. 18, 29-33 (2011)