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Papers

2014

1. (MMI)


2. H. Lee, J.H. Lee, Y.H. Hwang, Y. Kim, “Cyclic voltammetry study of electrodeposition of CuGaSe2 thin films on ITO-glass substrates”, Current Applied Physics, Vol. 14, pp. 18-22 (2014)


3. M.W. Jung, S.K. Kang, J.H. Lee, “Effects of Sodium Citrate Concentration on Electroless Ni-Fe Bath Stability and Deposition”, J. of Electronic Materials, Vol. 43,  pp. 290-298 (2014)


4. J. Chang, S.K. Kang, J.H. Lee, K.S. Kim, H.M. Lee, “Investigation of Sn Whisker Growth in Electroplated Sn and Sn-Ag as a Function of Plating Variables and Storage Conditions”,  J. of Electronic Materials, Vol. 43, pp. 259-269 (2014)

2013

5. Y.S. Song, T.H. Yim, S.K. Park, J.H. Lee, J. Kim, “Metal seed layer sputtering on high aspect ratio through-silicon via for copper filling electroplating”, Electrochimica Acta, Vol. 114, pp. 832-837 (2013)


6. S.Y. Park, M.W. Jung, J.H. Lee, “Nan oxide dispersed nickel composite plating”, Electronic Materials Letter, Vol. 9, pp. 801-804 (2013)


7. J.H. Kim, T.H.Yim, J.H. Lee, “Effects of bath and operating conditions on the composition of Ni-Fe alloy electroplating for solar cell substrate”, Vol. 13, pp. s108-s110 (2013)


8. J.H. Kim, M.W. Jung, T.H. Yim, J.H. Lee, “Effect of Electroplating Parameters on Electrodeposits of Invar Ally”, Journal of the Microelectronics & Packaging Society, Vol. 20, 39-43 (2013)

2012

9. H. Lee, H. Yoon, C. Ji, D. Lee, J.H. Lee, J.H. Yun, Y. Kim, “Fabrication of CIGS films by electrodeposition method for photovoltaic cells”, J. of Electronic Materials, Vol. 41, pp. cells”, Vol. 23, pp. 225602-225607 (2012)


10. W. He, J. Qiu, F. Zhuge, X. Li, J.H. Lee, Y.D. Kim, H.K. Kim, Y.H. Hwang, “Advantages of using Ti-mesh type electrodes for flexible dye-sensitized solar (2012)


11. M.W.JungJ.H.KimH.R.LeeT.H.Yim, J.H. Lee, “Fabrication of Nano Silica Dispersed Permalloy Composite Coating”, J. NanosciNanotechnol., Vol. 12, pp. 3402-3407 (2012)


12. T. AtabaevH.Vu, Y.D. Kim, J.H. Lee, H.K. Kim, Y.H. Hwang, “Synthesis and luminescence properties of Ho3+ doped Y2O3 submicron particles”, J. of Physics and Chemistry of Solids, Vol. 73, pp. 176-182 (2012)


13. S.Y. Park, J.H. Lee, “Electrodeposition of NanoTiO2 Powder Dispersed Nickel Composite Coating”, Journal of the Microelectronics & Packaging Society, Vol. 19, 65-69 (2012)


14. H. Lee, C. Ji, S. Woo, M. Choi, Y.H. Hwang, J.H. Lee, Y. Kim, “Formation of Copper Seed Layers and Copper Via Filling with Various Additives”, Kor. J. Mater. Res., Vol. 7, pp. 335-341 (2012)


15. I.S. Kang, Y.S. Koo, J.H. Lee, “The Effects of Levelers on Electroplating of Thin Copper Foil for FCCL”, Journal of the Microelectronics & Packaging Society, Vol. 19, 67-72 (2012)


16. M.W. Jung, K.T. Kim, Y.S. Koo, J.H. Lee, “The Effects of Levelers on Electrodeposition of Copper in TSV Filling”, Journal of the Microelectronics & Packaging Society, Vol. 19, 55-59 (2012)

2011

17. J.Y. Lee, J.H. Lee, “Effects of Electrochemical Parameters on Electrochemical Silicon Etching in Porous Silicon Layer Transfer Process”, J. Ceramic Proc. Res., Vol. 12, pp. 89-92 (2011)


18. S.Y.Cheon, S.Y. Park, Y.M. Ryim, D.H. Kim, J.H. Lee, “The Effects of Bath Conditions on the Electroless Nickle Plating on the Porous Carbon Substrate”, Curr. Appl. Phys., Vol. 11, pp.790-793 (2011)


19. S.Y. Park, M.W. Jung, J.H. Lee, “Dispersion Method of Silica Nanopowders for Permalloy Composite Coating”, Journal of the Microelectronics & Packaging Society, Vol. 18, 39-42 (2011)


20. S.Y. Cheon, Y.M. Rhym, J.H. Lee, “The Effects of Additives and Residual Stresses on the Electroless Nickel Plating on Carbon Substrate”, Journal of the Microelectronics & Packaging Society, Vol. 18, 43-48 (2011)


21. J.Y. Shim, Y.S. Moon, J.H. Lee, “Electrochemical Study of the Effect of Additives on High Current Density Copper Electroplating”, Journal of the Microelectronics & Packaging Society, Vol. 18, 49-54 (2011)


22. J.Y. Lee, Y.S. Koo, J.H. Lee, “Optimization of Electrochemical Etching Parameters in Porous Silicon Layer Transfer Process for Thin Film Solar Cell”, Journal of the Microelectronics & Packaging Society, Vol. 18, 23-27 (2011)


23. J.Y. Shim, Y.S. Moon, K.S. Hur, Y.S. Koo, J.H. Lee, “The Effect of Additives on the High Current Density Copper Electroplating”, Journal of the Microelectronics & Packaging Society, Vol. 18, 29-33 (2011)

2010

24. S. H. Kim, W. K. Han, J. H. Lee, “Electrochemical characterization of CdSe and CdTe thin films using cyclic voltammetry”, Current Applied Physics, vol. 10, 5481-5483 (2010)


25. J. Y. Lee, W. K. Han, J. H. Lee, “Effect of ultrasonic frequency on electrochemical Si etching in porous Si layer transfer process for thin film solar cell fabrication”, Solar Energy Materials & Solar Cells, Vol. 95, pp. 77-80 (2010)


26. S. H. Kim, J. Y. Lee, W. K. Han, J. H. Lee, “Electrochemical deposition of CdSe/CdTe multilayer nanorods for hybrid solar cell”, Thin Solid Films, 518 (2010) 7222-7224


27. D. G. Kim, J. H. Lee, “Kinetic Study of WC particles Incorporation in Nickel Composite Plating”, Surface Review and Letters, Vol. 17, (2010) 359-362


28. S. Y. Chun, Y. M. Rhyim, D. H. Kim, J. H. Lee, “Electroless Nickel Plating on Porous Carbon Substrate”, Journal of the Microelectronics & Packaging Society, Vol. 17, 75-80 (2010)


29. H. S. Jin, J. H. Lee, “Removal of Lead from Sea Water using Electrolysis and Coprecipitation Method”, Korean Society of Environmental Engineers, Vol. 32, 149~154 (2010)


30. D. K. Lee, J. S. Bang, M. G. Park, J. H. Lee, H. S. Yang, “Organic acid-based wet etching behaviors of Ga-doped ZnO films sputter-deposited at different substrate temperatures”, Thin Solid Films 518, 4046-4051 (2010)


31. S. J. Mun, M. S. Kim, T. H. Yim, J. H. Lee, “Mechanical and Structural Characteristics of Electrodeposited Ni-Fe-W Alloy after Heat-Treatment”, Journal of The Electrochemical Society, 157 (3) D177-D180 (2010)


32. H. K. Um, H. Y. Lee, T. H. Yim, J. H. Lee, “The Effects of Pretreatment and Surfactants on CNT and Permalloy Composite Electroplating”, Journal of the Microelectronics & Packaging Society, Vol. 17, 63-68 (2010)


33. M.W. Jung, J.H. Kim, H.Y. Lee, J.H. Lee, “Electrodeposition of Permalloy-Silica Composite Coating”, Journal of the Microelectronics & Packaging Society, Vol. 17, 83-33 (2010)


34. K.J. Park, M.W. Jung, J.H. Lee, “Effects of PEO Conditions on Surface Properties of AZ91 Mg Alloy”, Journal of the Microelectronics & Packaging Society, Vol. 17, 71-77 (2010)


35. S.Y. Cheon, S.Y. Park, Y.M. Rhym, D.H. Kim, Y.S. Koo, J.H. Lee, “Electroless Nickel Plating on Fibers for the Highly Porous Electrode”, Journal of Electrochemical Science and Technology, Vol. 1, 117-120 (2010)

2009

36. K. J. Park, J. H. Lee, “Effect of Electrolyte Composition on Corrosion Behavior of PEO Treated AZ91 Mg Alloy”, Corrosion Science and Technology, Vol. 8, 227~231 (2009)


37. C. W. Ji, S. H. Kim, J. H. Lee, Y. D. Kim, “Electrochemical Deposition of CdSe Nanorods for Photovoltaic Cell Applications”, Kor. J. Mater. Res. Vol. 19, No. 11, 596~600 (2009)


38. S. J. Park, J. Qiu, W. He, W. Namgung, Y. D. Kim, J. H. Lee, Y. H. Hwang, H. K. Kim, “ Fabrication of Volmer-Weber Type ZnO Nanorods by Combining RF Sputtering and Hydrothermal Methods”, Journal of Nanoscience and Nanotechnology, Vol. 9, 6993-6997, (2009)


39. W. He, J. Qiu, S. J. Park, J. H. Lee, Y. D. Kim, H. K. Kim, Y. H. Hwang, “The Fabrication of TiO2 Mesoporous Thick Films by Employing a Pre-Embedded ZnO Nanorods Support”, Journal of Nanoscience and nanotechnology, Vol. 9, 7145-7149, (2009)


40. J. Y. Lee, W. K. Han, J. H. Lee, “Electrochemical Etching of Silicon in Porous Silicon Layer Transfer Process for Thin Film Solar Cell Fabrication”, Journal of the Microelectronics & Packaging Society, Vol. 16, No. 4, pp. 55-60 (2009)


41. S. H. Kim, W. K. Han, H. S. Jin, J. H. Lee, “Electrochemical Analysis of CdTe Deposition Using Cyclovoltammetric Method for Hybrid Solar Cell Application”, J. Kor. Inst. Surf. Eng. Vol. 42, No. 5, (2009)

42. S. H. Kim, J. H. Lee, “Electrochemical Deposition of CdSe Nanorods for Photovoltaic Cell”, J. Kor. Inst. Surf. Eng. Vol. 42, No. 2, pp. 63~67 (2009)


43. J. Qiu, X. Li, W. He, S. J. Park, H. K. Kim, Y. H. Hwang, J. H. Lee, Y. D. Kim, “The growth mechanism and optical properties of ultralong ZnO nanorod arrays with a high aspect ratio by a preheating hydrothermal method”, Nanotechnology 20, 155603 (9pp) (2009)

2008

44. Y. K. Ko, T. H. Yim, J. H. Lee, “The Effects of Electroplating Parameters on the Mechanical Properties of Nickel-Iron Alloy Electrodeposits”, Journal of the Microelectronics & Packaging Society, Vol. 15, No. 4, p. 71-76 (2008)


45. Y. S. Moon, J. H. Lee, “Fabrication of Sn-Cu Bump using Electroless Plating Method”, Journal of the Microelectronics & Packaging Society, Vol. 15, No. 2, p. 17-21. (2008)


46. S. K. Lee, J. H. Lee, “The Effects of Additives on the Electropolishing of Copper Through Via”, Journal of the Microelectronics & Packaging Society, Vol. 15, No. 1, p. 45-50. (2008)


47. D. G. Kim, J. H. Lee, “Fabrication of WC and WC(Co) Codeposited Nickel Composite Coating by Electroplating Method for the Replacement of Chromium Coating, Materials Science Forum Vol. 569 (2008) pp 225-228

2007

48. S. K. Lee, Y. H. Kim, J. H. Lee, “Nucleation and Growth of Zinc Particles on an Aluminum Substrate in a Zincate Process”, Journal of Electronic Materials, Vol.36, No. 11,  pp. 1442-1447 (2007)


49. Y. M. Ahn, Y. J. Ko, H. J. Kim, D. H. Lee, S. E. Lee, J. H. Lee, “Effect of Plating Condition on the Mechanical Properties and Residual Stress of Electroplated Copper Film”, Advanced Materials Research, Vol. 26-28, pp. 637-640 (2007)


50. Y. K. KO, T. H. Yim, J. H. Lee, “The effects of Electroplating Parameters on the Morphologies and Composition of Nickel-Iron Alloy Electrodeposits”, J. of the Microelectronics and Packaging Society, Vol. 13, NO. 4, pp. 51-55 (2007)


51. S.E. Lee, J. H. Lee, “Copper Via Filling Using Organic Additives and Wave Current Electroplating”, J. of the Microelectronics and Packaging Society, Vol. 14, No. 3, pp. 37-42 (2007)


52. T. S. Oh, J. H. Lee, J. Y. Byun, T.S. Oh, “Effects of the Additives and Current Density on the Electrodeposition Behavior and Mechanical Properties of the Ni-SiC Composite Coatings”, Key Engineering Materials, Vol. 345-346, pp. 1533-1536 (2007)


53. Y. S. Moon, J. Y. Byun, T. S. Oh, J. H. Lee, “The Fabrication of Nickel-Diamond Composite Coating by Electroplating Method”, J. of the Microelectronics and Packaging Society, Vol. 14, No. 1, pp. 55-60 (2007)

2006

54. K. Y. Lee, T. S. Oh, T. S. Oh, J. H. Lee, “Electrical characteristics of the three dimensional interconnection structure for the chip scale package with Cu through vias”, J. of Electronic Materials, Vol.36, No.2, pp. 123-128 (2006)


55. J. H. Lee, “Direct Electroless Copper Plating on Polyimide fro FPCB Applications”, Materials Science Forum, Vol.544-545, pp. 709-712 (2006)


56. B. H. Cho, W. J. Lee J. H. Lee, “Effects of Electroplating Parameters on the Defects of Copper Via for 3D SiP”, Solid State Phenomena, Vol.124-126, pp.49-52 (2006)


57. W. Cho, Y. J. Ko, Y. M. Ahn, G. H. Chang J. H. LEE, “The Effects of Current Type and Density on Dishing Phenomena in CMP Process“, Solid State Phenomena, Vol. 124-126,  pp. 307-310 (2006)


58. Y. K. Ko, G. H. Chang J. H. LEE, “Nickel Tungsten Alloy Electroplating for the High Wear Resistant Materials Applications“, Solid State Phenomena, Vol. 124-126, pp. 1589-1592 (2006)


59. S. Y. Chang, Y. L. Kim, B. H. Song, J. H. LEE, “Effects of Current Ratio on Plasma Electrolytic Oxide Coatings on Mg-Al Alloy”, Solid State Phenomena, Vol. 124-126, pp. 767-770 (2006)


60. S. Y. Chang, Y. L. Kim, B. H. Song J. H. LEE, “Mechanical and Electrochemical Properties of Plasma Electrolytic Oxide Coatings on Magnesium Alloys”, Materials Science Forum, Vol. 539-543, pp. 1224-1229 (2006)


61. G. H. Chang, J. H. LEE, “Non-Electrolytic Deposition of Silver on Tungsten Powders for Functionally Gradient Composite Powder“, Materials Science Forum, Vol. 534-536, pp.1469-1472 (2006)


62. G. H. Chang J. H. LEE, “The Effects of Current Types on Through Via Hole Filling for 3D-SiP Application “, J. of the Microelectronics and Packaging Society, Vol.13, No.4, pp.45-50 (2006)


63. D. G. Kim J. H. LEE, ” Electrodeposition Behavior of Ni-WC Composite Coatings with Variation of WC Particle Size”, J. of the Korean Institute of Surface Engineering, Vol.39, No.3, pp. 115-120 (2006)


64. S. S. Byun, J. H. LEE, “The Effects of Copper Electroplating Bath on Fabrication of Fine Copper Lines on Polyimide Film Using Semi-additive Method “, J. of the Microelectronics and Packaging Society, Vol.13, No.2 (2006)


65. J. H. Min, J. H. Wu, J. U. Cho, Q. X. Liu, J. H. Lee, Y. D. Ko, J. S. Chung, Y. K. Kim, J. H. Lee, “The pH and current density dependence of DC electroplated CoCu thin films “, J. of Magnetism and Magnetic Materials, Vol.304, pp.100-102 (2006)


66. G. H. Chang, S. Y. Chang J. H. Lee, “Via/Hole Filling by Pulse-Reverse Copper Electroplating for 3D SiP”, Materials Science Forum, Vol. 510-511, pp. 942-945 (2006)

2005

67. S. W. Jun, K. Y. Lee, H. J. Won, J. Y. Byun, T. S. Oh, J. H. Lee, “Mechanical Properties of Ni Films and Ni-Al2O3 Composite Films Fabricated by Electroplating”, J. of the Microelectronics and Packaging Society, Vol.12, No. 3, pp. 256-265 (2005)


68. J. S. Bae, G. H. Chang, J. H. Lee, “Electroplating of Copper Using Pulse-Reverse Electroplating Method for SiP Via Filling”, J. of the Microelectronics and Packaging Society, Vol.12, No. 2, pp. 129-134 (2005)


69. K.Y. Lee, T.S. Oh, H.J. Won, T.S. Oh, J. H. Lee, “Interconnection Process and Electrical Properties of the Interconnection Joints for 3D Stack Package with 75 Cu Via”, J. of the Microelectronics and Packaging Society, Vol. 12, No. 2, pp. 111-119 (2005)

2004

70. I. G. Lee, T. Kang, N. S. Kim, S. Y. Oh, J. H. Lee, “The effects of bath composition on the morphologies of electroless nickel under-bump metallurgy on Al input/output pad”,  J. of  Electronic Materials, Vol.34, No.1 (2004)


71. J. H. Lee, “Electroless copper plating for metallization or electronic devices”, J. of the Microelectronics and Packaging Society, Vol.11, No.4, pp.75-80 (2004)


72. J. Y. Kim, J. Yu, T. Y. Lee, J. H. Lee, “The effects of electroplating parameters on the7composition and morphology of Sn-Ag solder”, J. of Electronic Materials, Vol.33, No.12, pp. 1459-1464 (2004)


73. J. S. Bae, J. H. Lee, “Copper via filling for SiP by pulse reverse electroplating”, MAP2004, pp.43 (2004)


74. W. Cho, Y. J. Ko, Y. M. Ahn, G. H. Chang., J. H. Lee, “Electrochemical kinetics study of electroless copper plating for electronics application”, Materials Science Forum, Vol.449,  pp.393-396 (2004)


75. H. Lee, K. Y Lee, J. S Bae, J. H Lee, J. Y Byun, D. B. Hyun, T. S. Oh,  Electrodeposition of Bi2Te3 for nanowire application”, Materials Science Forum, Vol.449,  pp.377-380 (2004)

2003

76. J. S. Bae, J. Y. Kim, J. Yoo, J. H. Lee, “The Effect of Electroplating Parameters on the Compositions and Morphologies of Sn-Ag Bumps”, J. of the Microelectronics and Packaging Society, Vol.10, No.4, pp. 73-79 (2003)


77. S. C. Lee, T. S. Oh, Y. H. Kim, J. H. Lee, “Fabrication of tin oxide film by sol-gel method for photovoltaic solar cell system”, Solar Energy Materials and Solar Cell, Vol. 75, pp. 481-487 (2003)


78. T. Sohn, H. J. Kim, J. H. Lee, “Excimer lase crystallization of a-ITO thin film deposited on plastics”, J. of the Korean Physical Society, Vol. 42, pp. 814-816 (2003)


Patents

 

1. S.H. Kim, S.E. Lee, Y.K. Ko, Y.S. Moon, J.H. Lee, “Electrochemical Polishing and Plating Method for Manufacturing of Through Via and Bumps in 3D SiP”, Korean Patent 10-1014839 (2011.2.28)


2. S.E. Lee, J.H. Lee, “Determining Method of the End Point of Electropolishing”, Korean Patent 10-1016237(2011.2.14)


3. 임영목김두현이재호, “니켈도금층이 구비된 탄소폼 및 이의 제조방법”, 대학민국 특허 10-2011-0123460 (2011. 11. 15)